http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019142733-A

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publicationDate 2019-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2019142733-A
titleOfInvention Method for predicting occurrence of stacking fault in epitaxial silicon wafer and method for manufacturing epitaxial silicon wafer
abstract A method for predicting the density or number of stacking faults in an epitaxial silicon wafer in which an epitaxial layer is formed on a phosphorus-doped ultra-low resistance silicon wafer is provided. The present invention relates to a residence time within a range of 570 ° C. ± 70 ° C. during cooling in a single crystal ingot, a resistivity or a phosphorus concentration of a phosphorus-doped ultra-low resistance silicon wafer, and a wafer input in pre-epi pre-annealing. The density or number of stacking faults occurring in the epitaxial layer is predicted based on the furnace temperature at the time and the growth temperature of the epitaxial layer. [Selection] Figure 1
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