| abstract |
An object of the present invention is to provide a flux and a solder paste using the flux, which can suppress the generation of voids and can suppress the generation of voids and improve the wettability of the solder. The flux contains rosin, tris (2-carboxyethyl) isocyanurate and a solvent, and contains 0.1 mass% or more and 15 mass% or less of tris (2-carboxyethyl) isocyanurate. The solder paste contains flux and metal powder, and the flux contains rosin, tris (2-carboxyethyl) isocyanurate and a solvent, and 0.1 to 15 mass% of tris (2-carboxyethyl) isocyanurate Including. 【Selection chart】 None |