| abstract |
The present invention relates to a method for manufacturing a substrate component (10, 10 '') connected to an electronic component (30), and a substrate (11) having a first surface (12) and a second surface (13). ), A step of applying a contact material layer (15) to the first surface (12) of the substrate (11), and a contact material layer (15) facing away from the substrate (11). Applying a pre-fixing agent (18) to at least a portion of the surface (16). The present invention also relates to a corresponding substrate structure (10, 10 '') and a corresponding method of connecting at least one electronic component (30) to the substrate structure (10, 10 ''). The claimed means provide sufficient handling strength during transport from the assembly location to the connection location. The contact material layer (15) is preferably applied over or over the entire surface of the first surface (12) of the substrate (11). The substrate (11) to which the contact material layer (15) is applied and the prefixing agent (18) is applied can be detachably arranged on the carrier (20). When connected to the electronic component (30, 30 ′), the substrate component (10, 10 ″) is sintered, crimped, soldered and / or bonded to the electronic component. The substrate (11) is a metal plate or a piece of metal, specifically a copper plate or piece of copper, a lead frame, a DCB substrate or a PCB substrate. The electronic component (30) can be a semiconductor, a DCB substrate or a PCB substrate. [Selection] Figure 3 |