| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0058
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0083 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0753
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-483
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-502
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-60 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-64 |
| filingDate |
2016-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2018-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2018520519-A |
| titleOfInvention |
Optoelectronic component, assembly of optoelectronic component, and method of manufacturing optoelectronic component |
| abstract |
The present invention comprises a semiconductor chip (1) configured to emit radiation (5) via at least a main radiation surface (11) and a conversion element (2) arranged in the beam path of the semiconductor chip (1). And a sealing element (3) comprising a covering element (31) and a side element (32) and constituting at least one sealing part for the conversion element (2) against environmental influences (100). The covering element (31) is disposed on the conversion element (2), and the side surface element (32) is disposed on the side of the semiconductor chip (1) and the conversion element (2) in cross section. Surrounding. The side element (32) and the covering element (31) are at least partly in direct contact, and the side element (32) contains at least one metal. |
| priorityDate |
2015-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |