| abstract |
A semiconductor device on which a light emitting element is mounted, which can be easily miniaturized, has a structure with good light emission efficiency, can be easily formed, and the semiconductor device is efficiently manufactured. A manufacturing method is provided. A semiconductor device includes a substrate, a light emitting element flip-chip mounted on the substrate, and a sealing structure that seals the light emitting element. The sealing structure includes the substrate. And a phosphor film formed on the inner wall surface of the sealing structure having a structure in which a partition formed by plating so as to surround the light emitting element and a lid installed on the partition are joined And the partition is configured to function as a reflector that reflects light emitted from the light emitting element. [Selection] Figure 2 |