| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fec576c38e34882531ca37d6b922bf42 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5445 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D127-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-63
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02057 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-18 |
| filingDate |
2017-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1a8f8b0bc2364ca6fe941973232b8a30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eea986bf96407cf0822e8973c3924fe5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a3e8b289b485bdd0a0191e0d4006416d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6990198dd6b31314b784d3cde874cbe |
| publicationDate |
2018-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2018137426-A |
| titleOfInvention |
Chemical solution for water-repellent protective film formation |
| abstract |
PROBLEM TO BE SOLVED: To provide a chemical solution for forming a water repellent protective film capable of suppressing swelling and discoloration of a vinyl chloride resin and precipitation of a solid substance in the chemical solution in a wafer cleaning apparatus containing a vinyl chloride resin as a liquid contact member. . SOLUTION: At least one first solvent selected from the group consisting of an ether solvent and a hydrocarbon solvent, a second solvent consisting of a glycol ether, a silylating agent represented by the following general formula [1], and the following general formula [2] and / or the chemical solution for forming a water repellent protective film containing a base represented by the following general formula [3] is supplied to the wafer 1 having the fine uneven pattern 2 on the surface, and the protective film is formed on the surface of the recess 4 Form. (R 1 ) a (H) b Si (OCOR 2 ) 4-a-b [1], (R 3 ) c (H) d Si (X) 4-c-d [2], [(R 4 ) e (H) f Si] 2 NH [3] [Selected figure] Figure 3 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3979004-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11670498-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7189427-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019124264-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020038333-A |
| priorityDate |
2017-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |