Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48257 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-035 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-206 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-442 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-14 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-14 |
filingDate |
2016-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c224b965e795ac9e0c6d64a246a0ebc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f0caac804979235069851d565061892 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_64602439399aa75ae5db623f3de374d1 |
publicationDate |
2018-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2018076415-A |
titleOfInvention |
Heat curable silicone composition, die bond material and optical semiconductor device |
abstract |
The present invention provides a thermosetting silicone composition that provides a cured product that overcomes uncured surface portions due to oxygen inhibition. An organo (poly) siloxane having a structure represented by the formula (1): 100 parts by mass, an organic peroxide containing a diacyl peroxide or a peroxy ester: 0.1-30 parts by mass, and one molecule Heat containing organohydrogenpolysiloxane containing at least two hydrogen atoms bonded to silicon atoms: 0.1 to 20 parts by mass and platinum catalyst: 0.01 to 1,000 ppm A curable silicone composition. [Selection] Figure 1 |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021229944-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020143246-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I801654-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7296748-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115516038-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022172614-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020202932-A1 |
priorityDate |
2016-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |