http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017183558-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f56b5174f7d196258707ccf1d609796e |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32862 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32522 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 |
| filingDate | 2016-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8dd1795282e6673829adae0dddf0d6a9 |
| publicationDate | 2017-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2017183558-A |
| titleOfInvention | Semiconductor device manufacturing method and dry etching apparatus maintenance method |
| abstract | 【Task】 Improve the manufacturing yield of semiconductor products by reducing foreign matter after processing chamber maintenance of dry etching equipment and stabilizing etching characteristics. [Solution] Prior to evacuation after maintenance of the processing chamber, the temperature of the processing chamber is raised to the actual process temperature or more, and residual moisture adsorbed in the processing chamber is sufficiently removed, and then the processing chamber is evacuated. [Selection] Figure 3 |
| priorityDate | 2016-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 19.