| abstract |
An improved pattern processing method that enables formation of a fine pattern during manufacture of an electronic device is provided. (A) providing a semiconductor substrate with a patterning feature on a surface; and (b) applying a patterning composition to the patterning feature, wherein the patterning composition comprises: Applying a polymer comprising a surface-attaching group to form a bond with the surface of the patterning feature and a solvent, wherein the patterning composition does not comprise a cross-linking agent; and (c) a first rinse. Removing the residual patterning composition from the substrate with an agent, leaving a polymer coating bonded on the surface of the patterning feature; and (d) a second rinse different from the first rinse. Rinsing patterning features coated with a polymer, wherein the polymer has a higher solubility in the first rinse than in the second rinse. Down processing method. [Selection] Figure 2 |