http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017092264-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_421cadb30fc0074fe61126eb980d19d6 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 |
| filingDate | 2015-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09b1c70d3158336bfea6be53ee4a8b4c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c2b4d5b48fdf055d6411a3886001713 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_322898ace294c41893dc08034f08bff7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e72cdc0ff85db1da6c6f43192e8ae5c1 |
| publicationDate | 2017-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2017092264-A |
| titleOfInvention | Plasma processing method |
| abstract | Disclosed is a plasma processing method capable of reducing foreign substances caused by a processing chamber surface member. In a plasma processing method using a plasma processing apparatus having a processing chamber in which a first material region containing Si and O and a second material region containing a hardly volatile material are arranged on the surface, A CHxFy film is selectively deposited on the second material region with respect to the first material region (S210), and then an object to be processed disposed inside the processing chamber is plasma-treated (S220). [Selection] Figure 2 |
| priorityDate | 2015-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.