abstract |
Disclosed are a chemically amplified positive resist composition and a pattern forming method capable of forming a pattern with high sensitivity and short development time without generating dimples on a pattern side wall. (A) A polymer compound soluble in an alkaline aqueous solution and having a repeating unit of the formula (1), A chemically amplified positive resist composition comprising (B) an aqueous alkali-soluble polymer compound, (C) a photoacid generator, and (D) an organic solvent. [Selection figure] None |