| abstract |
The curable composition includes an epoxy resin and an amine curing component, and the amine curing component includes an aromatic amine curing agent, an aliphatic amine, an alicyclic amine, a nonvolatile primary alcohol, a nonvolatile solvent, or And solubilizers containing these mixtures. Also disclosed is an electronics assembly that includes a substrate, an underfill comprising a cured product of the curable composition on the substrate, and a ball grid array on the underfill. |