http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013014695-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6c8d4dc7bd1a30d8fda907fceaeb4e69 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2011-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e206b4aadc7d1cd109f73446ca1fb3b |
| publicationDate | 2013-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2013014695-A |
| titleOfInvention | Interlayer filler composition for three-dimensional stacked semiconductor device and coating solution thereof |
| abstract | An interlayer filler composition that is suitable for a manufacturing process of a three-dimensional stacked semiconductor device and has an excellent performance balance such as thermal conductivity and heat resistance, a coating liquid containing the interlayer insulating filler composition, Cured product of the interlayer insulating filler composition, method for producing a three-dimensional stacked semiconductor device using the interlayer insulating filler composition, and three-dimensional stack containing a cured product of the interlayer insulating filler composition A type semiconductor device is provided. An interlayer filler composition for a three-dimensional stacked semiconductor device, comprising an epoxy resin (A) that is solid at room temperature and an epoxy resin (B) represented by the following formula (1). [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016538415-A |
| priorityDate | 2011-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 299.