http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016098312-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0c20dac5f1a44475c96d2db944e79786 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-521 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate | 2014-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5609b796e84e3f383135e4d3afb77c07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_90c129aa5bf78308300568feac494342 |
| publicationDate | 2016-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2016098312-A |
| titleOfInvention | Curable resin composition, dispensing die attach material, and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide a curable resin composition having a low viscosity, a high change index, and a high thermal conductivity after curing. SOLUTION: (A) an epoxy resin, (B) an inorganic filler having a mode particle size of 0.1 to 10 μm in a particle size distribution, and (C) a dispersant having a specific phosphate group. Is a curable resin composition. In the curable resin composition, the component (C) is preferably 0.5 to 5 parts by mass with respect to 100 parts by mass of the curable resin composition. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018172695-A |
| priorityDate | 2014-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 87.