| abstract |
Provided is a resin paste composition that can be cured at a low temperature (125 ° C.) or less, has excellent adhesive strength, and causes bleed out, and has good workability. (A) A compound selected from an acrylic ester compound and a methacrylic ester compound, (B) a peroxide represented by the following general formula (1) and having a 10-hour half-life temperature of 60 to 80 ° C. A resin paste composition comprising a product, (C) a flexible material, and (D) a filler containing a non-spherical filler and a spherical filler. (In the formula (1), R represents an alkyl group having 1 to 10 carbon atoms or a 2-acylperoxypropyl-2-yl-alkylene group, and R 1 represents an alkyl group having 3 to 10 carbon atoms.) [Selection figure] None |