http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016039355-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_985f1bf0df4204078e687f8417dc5871
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32724
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
filingDate 2014-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2795f9d19675feaffc14fe419178e64c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_952f071d8047f2877ec20acbbe226313
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b8887e91d604b748930cf65d2d199d63
publicationDate 2016-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2016039355-A
titleOfInvention Substrate processing apparatus and substrate processing method
abstract A substrate processing apparatus and a substrate processing method for efficiently processing a substrate are provided. A substrate processing method according to an embodiment of the present invention includes providing a substrate on which an oxide layer is formed, and treating the oxide layer with a first process gas in a plasma state to replace the byproduct layer. The substrate is heated to a temperature that is equal to or higher than a first heating temperature that is a temperature at which the by-product layer is decomposed and that is equal to or higher than a second heating temperature that is a boiling point of an additional by-product that is generated in the process of decomposing the by-product layer Heating the substrate to remove the byproduct layer from the substrate. [Selection] Figure 3
priorityDate 2014-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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