http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016015384-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_669c01133740c5233f2c8738904ea3af
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
filingDate 2014-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e032ea171a8cd7872b2291a2424d1c2d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d6342ad0ccd741e45e78015ab576ba20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_73a89c5c50f891d0fa0f91b4dbbce925
publicationDate 2016-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2016015384-A
titleOfInvention Method for manufacturing electronic device using chip-on-substrate
abstract In manufacturing an electronic apparatus in which an electronic device is stacked on a COF substrate, the basic configuration of the COF substrate is maintained, and sufficient for external force in the bending direction with respect to the COF substrate without reducing the productivity. To provide an electronic device having strength. An electronic device manufacturing method for manufacturing an electronic device by mounting an electronic device on a chip-on substrate having a metal wiring portion formed on a surface of the substrate film. A substrate heat resistance improving step for performing an annealing process for improving the heat shrinkage start temperature, and an electrical connection between the metal wiring part 13 and the electronic device 2, and containing tin, silver, and copper And a high temperature soldering process performed with a high melting point solder having a melting point of 200 ° C. or higher. [Selection] Figure 2
priorityDate 2014-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 21.