| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0789
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1492
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1476 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-424 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
2012-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2015-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2015503033-A |
| titleOfInvention |
Method for the combination of through-hole plating and via filling |
| abstract |
The present invention relates to a copper electroplating method in the manufacture of printed circuit boards or IC boards. This method is suitable for a combination of conformal plating of through-holes (5) and filling of blind microvias (6). The method uses a metal redox system and pulse reversal plating and includes a dielectric core layer (1), an inner copper layer (3), a dielectric outer layer (2), and an outer copper layer (4). Includes combinations of multilayer stacks. A first copper layer (7) is formed by flash plating and then copper (8) is electroplated by pulse inversion plating. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102254649-B1 |
| priorityDate |
2011-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |