| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0392
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-241 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 |
| filingDate |
2007-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2009-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2009532586-A |
| titleOfInvention |
Electrolytic copper plating method |
| abstract |
An electrolytic copper plating method including two steps is proposed. The method is particularly suitable for plating in very narrow places. The first step comprises a pretreatment solution comprising a sulfur-containing organic compound, preferably an anti-suppressive agent comprising one or more alkanesulfonic acid ester groups and / or alkanesulfonic acid. The second step includes an electrolytic copper plating solution based on alkane sulfonic acid. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7136814-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102061026-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020523481-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016216830-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013044007-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013044035-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015503033-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012127003-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10468364-B2 |
| priorityDate |
2006-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |