http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015216197-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-60 |
| filingDate | 2014-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f43047eee705c62724961c693611ac3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c224b965e795ac9e0c6d64a246a0ebc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_629adb3892716db8d169c30ef61285e1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f0caac804979235069851d565061892 |
| publicationDate | 2015-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2015216197-A |
| titleOfInvention | Wafer level optical semiconductor device manufacturing method, optical semiconductor device manufacturing method, and optical semiconductor device |
| abstract | [PROBLEMS] To reduce the number of members, to prevent the prevention of sulfidation, to withstand the driving of a high-power optical semiconductor element, to have high dimensional accuracy of the product, to reduce unevenness and variation in emission color, and to improve the product characteristics after manufacture. Provided is a method for manufacturing a member for a wafer level optical semiconductor device, which makes it possible to easily manufacture an optical semiconductor device that can be easily managed at low cost. (I) a step of mounting a plurality of optical semiconductor elements on an adhesive sheet surface of a support substrate provided with an adhesive sheet; and (ii) an adhesive sheet surface on which the optical semiconductor elements of the support substrate are mounted and light transmittance. A method comprising supplying a thermosetting resin composition between the members, molding and curing the composition to obtain a laminate, and (iii) peeling the support substrate and the adhesive sheet from the laminate, In the step (i) or (ii), a method for producing a wafer level optical semiconductor device member comprising a light reflective thermosetting resin at a portion corresponding to a dicing line and a light reflective member having a hardness of Shore D of 20 or more. . [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102017104479-B4 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020508565-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200099989-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7030826-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11158771-B2 |
| priorityDate | 2014-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 82.