| abstract |
PROBLEM TO BE SOLVED: To provide an addition curable silicone resin composition for a light emitting diode, which has high resistance to thermal shock and is hardly cracked even under severe temperature cycles. [Solution] General formula (1): -(R 1 2 SiO) n- (1) (Wherein R 1 is an unsubstituted or substituted monovalent hydrocarbon group having no unsaturated aliphatic bond, and n is an integer of 1 or more), and a general formula : R 2 3 SiO 1/2 (wherein R 2 is an unsubstituted or substituted monovalent hydrocarbon group, alkoxy group or hydroxyl group), a Q unit represented by the formula SiO 2 and And / or an organopolysiloxane comprising a T unit represented by the formula R 2 SiO 3/2 (wherein R 2 is as described above) and a resinous segment in which at least two of the total R 2 are alkenyl groups. An addition-curable silicone resin composition for light-emitting diodes, comprising siloxane as a base polymer. [Selection figure] None |