http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015208779-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6bd0cdbc5c67cf4957ed83c89140748e |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 |
filingDate | 2014-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75339238b03822fd3a52e15bd95768e7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c6ea9bd7818514bac351750e2a1b04fa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df58f40c9646fd88b978df61cc8c3218 |
publicationDate | 2015-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2015208779-A |
titleOfInvention | Solder flux and solder paste |
abstract | A non-cleaning type solder that is less likely to change with time when mixed with solder alloy powder to form a solder paste, and that can suppress the occurrence of migration and flux residue during bonding. Provide flux for use. A solder flux is composed of 35 to 70% by mass of a flux main component, 1 to 15% by mass of an acetylene alcohol compound, and 1 to 15% by mass of a phosphate ester. At this time, the flux main component is at least one selected from the group consisting of rosin, modified rosin, abietic acid and modified abietic acid, the softening point is 70 to 170 ° C., and the acid value is 100 to 200 mgKOH / Use what is g. [Selection figure] None |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021087983-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6275311-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021111712-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106392380-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018202436-A |
priorityDate | 2014-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 125.