http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015207669-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05 |
| filingDate | 2014-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e94f81c2e2eed900c05940eacd1fb3e6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_035f220ade7116032621666e6afcdaf3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3881960f8fe80c901fa14a105bb23a01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_654b976206453e58aacfc88bc3bc73bc |
| publicationDate | 2015-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2015207669-A |
| titleOfInvention | Metal base substrate, metal base circuit board and electronic device |
| abstract | To provide a metal base substrate in which warpage of the metal base substrate is sufficiently suppressed without using an expensive inorganic filler and which has high heat dissipation characteristics. A metal base substrate 100 according to the present invention includes a metal substrate 101, an insulating resin layer 102 provided on the metal substrate 101, and a metal layer 103 provided on the insulating resin layer 102. The insulating resin layer 102 includes an epoxy resin, alumina, and a glass fiber substrate, and the content of the alumina is 100 mass of the total solid content of the epoxy resin composition forming the insulating resin layer. % To 75% by mass to 95% by mass. [Selection] Figure 1 |
| priorityDate | 2014-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 75.