| abstract |
The present invention provides a circuit board that has better heat resistance and moisture resistance than conventional ones. (1) An epoxy resin which is a diglycidol derivative having a naphthalene structure as a main skeleton, (2) a phenol novolac resin, a cresol novolac resin or a bisphenol A novolac resin, (3) a bismaleimide resin, and 4) A curable resin composition comprising 2,3-dihydro-1-H-pyrrolo [1,2-a] benzimidazole, which contains an inorganic filler. A curable composite material characterized in that the circuit board is characterized by using the curable composite material. The circuit board is preferably a metal-based circuit board and has a maximum use temperature of 180 ° C. to 200 ° C. [Selection figure] None |