| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-36 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05 |
| filingDate |
2014-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3881960f8fe80c901fa14a105bb23a01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_654b976206453e58aacfc88bc3bc73bc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_035f220ade7116032621666e6afcdaf3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e94f81c2e2eed900c05940eacd1fb3e6 |
| publicationDate |
2015-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2015207668-A |
| titleOfInvention |
Metal base substrate, metal base circuit board and electronic device |
| abstract |
Disclosed is a metal base substrate in which warpage is sufficiently suppressed even in a harsh environment with a large temperature change. A metal base substrate of the present invention includes a metal substrate, an insulating resin layer provided on the metal substrate, and a metal layer provided on the insulating resin layer. 103 is made of copper, and the metal substrate 101 is made of an aluminum alloy containing silicon carbide. [Selection] Figure 1 |
| priorityDate |
2014-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |