| abstract |
A resin material for forming an insulating film is reduced and a pattern is formed with high accuracy. A method of manufacturing a semiconductor device including a step of forming an insulating film such as a protective film or a sealing film, the connection pad 11 being electrically connected to a circuit element formed on a main surface, or the connection pad 11 Insulating photosensitive resin films 17a and 17b are formed by inkjet on the semiconductor substrate 10 having the rewiring 16 connected to the substrate 10 except for at least the edge portion of the substrate 10, and then the photosensitive resin film 17a is photolithography. Pattern by technology. [Selection] Figure 3 |