http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015140469-A

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filingDate 2014-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c589bd00806c162991f85a0d390ed4f
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publicationDate 2015-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2015140469-A
titleOfInvention Electronic component having Ag-Sb plating film, Ag-Sb plating solution, and method of manufacturing the electronic component
abstract An object of the present invention is to provide an electronic component having high gloss, high light reflectance, and no reduction in glossiness due to heat treatment. SOLUTION: An Ag—Sb alloy plating film is provided on a copper material or a copper plating film directly or via a base Ni plating film, and the Ag—Sb alloy plating film has an Sb quality of 0.1 to 2. An electronic component having a thickness of 0.1% by mass and a thickness of 0.1 to 10 μm. The Ag—Sb alloy plating film has a reflectance of 89% or more, a glossiness of 1.8 or more, and a reduction in glossiness due to heat treatment (200 ° C. to 1 hr.) Is 20% of the glossiness before heat treatment. It becomes as follows. [Selection figure] None
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