http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015130385-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_421cadb30fc0074fe61126eb980d19d6 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N50-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32131 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 |
| filingDate | 2014-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc05ca9c399d1404513d37b49cacc573 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd4bd8fb51793ddb66569febe68e05dd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26e223a62e166f9a2183b2a58ded92b2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2568fc8de2e8c69a0ed71567f2a36c1 |
| publicationDate | 2015-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2015130385-A |
| titleOfInvention | Plasma etching method |
| abstract | The present invention relates to a plasma etching method for reducing a dimension of a film to be etched from a dimension that is not patterned, and to reduce the dimension without causing disconnection or bending of the film to be etched due to the size reduction. A plasma etching method is provided. The present invention relates to a plasma etching method for plasma-etching a film to be etched to a dimension thinner than the predetermined dimension by using a mask patterned to a predetermined dimension, and forming a protective film on a side wall of the film to be etched. The etching target film is etched to be thinner than the predetermined dimension. [Selection] Figure 5 |
| priorityDate | 2014-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.