http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015039015-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4af0df9a26ff4aafde7285cbd8eb12f4 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68381 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-308 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3043 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0095 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 |
| filingDate | 2014-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2eebca3517f423842da2c23c1bbe0a88 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_970aaf240653a697f2fa303e27c22a2c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_249a7e8db9105a0d5436767d688d192b |
| publicationDate | 2015-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2015039015-A |
| titleOfInvention | Manufacturing method of semiconductor piece |
| abstract | The present invention provides a method for manufacturing a semiconductor piece that suppresses the remaining of an adhesive layer on the surface of a semiconductor substrate. A method of manufacturing a semiconductor piece according to the present invention includes a first film portion 752 and a first film portion 752 formed on a surface of a semiconductor substrate W. Forming a photoresist 750 having a second film portion 754 extending upward from the upper end at an angle narrower than the angle at which the opening width of the first film portion expands; and using the photoresist 750, the substrate A surface having a first groove portion whose width is gradually narrowed toward the back surface of the substrate, and a second groove portion which is not narrower than the width of the lowermost portion of the first groove portion and faces the back surface side of the substrate Forming a groove on the side by anisotropic dry etching, attaching a dicing tape having an adhesive layer on the substrate surface, and dicing blades on the back side along the surface side groove from the back side of the substrate And the process of forming And a step of peeling off the dicing tape after. [Selection] Figure 12 |
| priorityDate | 2013-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 31.