| abstract |
A dry film resist remover composition capable of completely removing a dry film resist and preventing corrosion of a metal layer and reusing the remover, and a dry film resist using the same Provide removal method. A dry film resist remover composition comprising a hydroxide compound, a chain amine compound, a triazole compound, and pure water. And, the step of laminating the dry film 20 on the substrate 100 on which the predetermined circuit pattern 10 is formed, the step of partially exposing the laminated dry film 20, and the development and removal of the dry film non-exposed portion 21 Forming the opening, providing the solder ball 30 on the circuit pattern 10 having the opening, and bringing the dry film resist stripper composition into contact with the dry film exposure unit 22. And a method for removing a dry film resist. [Selection] Figure 1 |