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filingDate 2012-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2014-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2014534987-A
titleOfInvention Polymer PTC thermistor
abstract The subject of this application is a curable adhesive composition having PTC properties after curing comprising (i) a reactive binder system based on an epoxy resin component and a curing agent component, (ii) carbon-modified particles in the range of 0.01% to 15.0% by weight, based on the total weight of the curable adhesive composition; (iii) copper powder in the range of 0.5 wt% to 5.0 wt% based on the total weight of the curable adhesive composition; The reactive binder system is a composition comprising more than 70% by weight of the total organic polymer of the adhesive composition.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019178212-A
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