| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8cf8d77ac0eff1767b22d2fb9445b64d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-3344
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-334
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-332
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-0203 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32477
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32495
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32724
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32715
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-4404
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68735
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6715
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 |
| filingDate |
2014-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a02db22c3089c77bc2ed95a15d0bed8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d3096b69b829c1c372f4e1ca2bff829 |
| publicationDate |
2014-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2014220502-A |
| titleOfInvention |
Plasma processing chamber components comprising a protective layer formed in situ on a plasma exposed surface |
| abstract |
A method for protecting a plasma exposed surface of a component of a plasma processing chamber is provided. A component of a plasma processing chamber comprising a liquid protective layer on a plasma exposed surface of the component. The liquid protective layer can be replenished by supplying liquid to the liquid channel and delivering the liquid through the liquid supply path of the component. The component may be an edge ring assembly 200 surrounding the semiconductor substrate supported by the substrate support unit 118 in a plasma processing apparatus that generates plasma and processes the semiconductor substrate 120 using the generated plasma. Alternatively, the solid protective layer may be formed by sufficiently curing or cooling the liquid protective layer. [Selection] Figure 1A |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023080017-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10755902-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7145041-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016225588-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018190783-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11705312-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7110076-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022140263-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102581226-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180074013-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020088280-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023058495-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11495444-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7344153-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020077785-A |
| priorityDate |
2013-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |