http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014141667-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_758994071efb42b565fc2c04637be131 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11B5-84 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 |
| filingDate | 2013-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b4adad6ae3b5e8d506c4a25946aeabe http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ec3f2d436a876a5e348cf37c40960fd |
| publicationDate | 2014-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2014141667-A |
| titleOfInvention | Polishing liquid for electronic materials |
| abstract | In a polishing process in an electronic material manufacturing process, defects such as end face sagging and the like are reduced, and metal ions eluted from equipment are less precipitated than a conventional polishing liquid. Furthermore, in the subsequent cleaning process, polishing slurry for electronic material that can easily remove polishing waste generated by polishing, polishing method for polishing an electronic material intermediate using this polishing slurry for electronic material, and electron in this polishing method An object of the present invention is to provide a method for producing an electronic material including a step of polishing a material intermediate. The present invention provides an electronic material containing the following neutralized salt (AB), chelating agent (C), an acid component (D) other than the chelating agent (C), and abrasive particles (P) as essential components. A polishing method; a polishing method for polishing an electronic material intermediate using the polishing liquid for electronic material; and a method for producing an electronic material including a step of polishing the electronic material intermediate by the polishing method. Neutralized salt (AB): acidic compound (A) having at least one acid group (X) in the molecule; Change in heat of formation in proton addition reaction (Q2) is a salt with a nitrogen-containing basic compound (B) having 10 to 152 kcal / mol, and change in heat of formation in acid dissociation reaction of acid group (X) (Q1) Is a neutralized salt of 3 to 200 kcal / mol. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108499963-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019216205-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7158889-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106590440-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109338438-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11643573-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019197604-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7118590-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110923727-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015227446-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10703935-B2 |
| priorityDate | 2012-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 283.