| abstract |
Disclosed is a chemically amplified negative photoresist resin composition capable of forming a resist film having high sensitivity and excellent balance of various properties required for a resist film. A polymer composed of a copolymer represented by the formula (1), a photoacid generator, and a first crosslinking agent that crosslinks the polymer using an acid generated from the photoacid generator as a catalyst. Chemically amplified negative resin composition for photoresist. (In formula (1), R 1 , R 2 , R 3 and R 4 are each independently hydrogen or an organic group having 1 to 30 carbon atoms, and A is a structural unit derived from maleic acid) [Selection figure] None |