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filingDate 2014-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2014-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2014129231-A
titleOfInvention Sintered body and sputtering target
abstract The present invention provides a large sputtering target that makes it possible to efficiently produce a large and homogeneous sintered body at low cost and has good discharge characteristics and the characteristics of the obtained thin film. [Solution] At the time of pressure compression, it is possible to press the filled raw material powder substantially only from one axial direction, and to release the pressure isotropically to the molded body at the time of pressure reduction after the pressurization is completed. By using the mold 2 having the structure, the spring back at the time of molding is efficiently eliminated, and a cold isostatic press at a high molding pressure is enabled. This makes it possible to directly produce compacts with good shape accuracy using raw material powders that do not contain organic substances such as binders, and to efficiently produce large, homogeneous, and low-carbon sintered bodies with a high yield. Can be manufactured. [Selection] Figure 3
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