| abstract |
A degreasing agent for pretreatment of a photo solder resist, which does not deteriorate the bondability between a printed circuit board and PSR ink, has excellent cleaning power, and can significantly reduce copper appearance defects and SR foreign matter defects, and the same. A degreasing method is provided. A degreasing agent for pretreatment of a photo solder resist of the present invention contains glycol ether, alcohol amine, amine surfactant and water. [Selection figure] None |