| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_34c067d1bbfe85ac23d961d454a35d0e |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K101-40 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C13-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 |
| filingDate |
2012-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dfa4082a00246cbb0466e431cb96ce7c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ad1be2e47eca26c27ba744637e150e9 |
| publicationDate |
2014-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2014004590-A |
| titleOfInvention |
Solder composition |
| abstract |
Provided is a solder composition having excellent pin standability in a pin grid array package. A solder composition of the present invention is a solder composition for a pin grid array package, and is composed of a lead-free solder powder and a flux, and the lead-free solder powder is 89% by mass or more and 91% by mass of tin. %, And antimony 9 mass% or more and 11 mass% or less, and the flux content is 7.5 mass% or more and 10.5 mass% or less with respect to 100 mass% of the solder composition. It is characterized by. [Selection figure] None |
| priorityDate |
2012-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |