| abstract |
Provided is a conductive thermosetting resin composition that can be mounted by a reflow process at a low temperature using low-temperature molten solder particles and has good storage stability at room temperature. [Solution] A flux component containing solder particles having a melting point of 180 ° C. or less, a thermosetting resin binder, and a carboxylic acid anhydride is contained in the thermosetting resin composition. In the thermosetting resin composition, the flux action of the flux component is suppressed at room temperature, and the increase in viscosity is suppressed. Also, when this thermosetting resin composition is used and component mounting is performed under low temperature heating, the solder particles are melted and the carboxylic acid anhydride of the flux component is hydrolyzed to generate a carboxyl group and exert a flux action. Then, the oxide layer on the surface of the solder particles is removed, and the integration of the solder particles is promoted, thereby ensuring electrical bondability. In addition, the thermosetting resin binder is thermoset, and the cured product can ensure mechanical bondability. [Selection figure] None |