| abstract |
[PROBLEMS] To improve adhesion and reliability of a sealing layer to a high thermal conductive substrate when hermetically sealing between a glass substrate and a high thermal conductive substrate by applying local heating by electromagnetic waves. An airtight member is provided. A hermetic member includes a glass substrate, a high thermal conductivity substrate, and a sealing portion that hermetically seals a gap between the substrates. The sealing portion 6 includes a glass layer 7 provided in advance in a sealing region of the high thermal conductive substrate 3 and a sealing layer 8 made of a fused and fixed layer of a sealing glass material having electromagnetic wave absorbing ability. The glass layer 7 has electromagnetic wave absorbing ability and has a thickness in the range of 3 μm or more and less than 20 μm. The sealing layer 8 is formed between the glass substrate 2 and the glass layer 7. [Selection] Figure 1 |