http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013197211-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a665d61597c2731ab4130971ee397dc9 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 |
| filingDate | 2012-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f3fbd6824067e90f9286f54a9d7a4a0 |
| publicationDate | 2013-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2013197211-A |
| titleOfInvention | Polishing composition |
| abstract | When a polishing object having a part containing a group IV material and a part containing a silicon material is used for polishing, it can exhibit high polishing selectivity for a part containing a group IV material. A polishing composition is provided. The polishing composition of the present invention contains abrasive grains having an average primary particle size of 40 nm or less and an oxidizing agent, and preferably a surface OH group of a portion containing a silicon material of an object to be polished. It further contains a hydrolysis inhibiting compound that functions to bind and inhibit hydrolysis of the portion containing the silicon material. Alternatively, the polishing composition of the present invention contains abrasive grains, an oxidizing agent, and a hydrolysis inhibiting compound. It is preferable that pH of polishing composition is neutral. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2016052408-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7261630-B2 |
| priorityDate | 2012-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 160.