| abstract |
The present invention provides a curable resin composition that can provide a cured product having excellent heat resistance and is useful for various applications, a method for producing the same, and an electronic packaging material using the curable resin composition. A curable resin composition containing a benzoxazine compound and a silane compound having a siloxane skeleton and an imide bond, and a curable resin composition containing a benzoxazine compound, a polyfunctional maleimide compound, and an imidazole compound. [Selection figure] None |