| abstract |
【Task】 An object of the present invention is to provide a polyimide composition in which white powder does not appear without acid cleaning even after alkali development, a flexible wiring board using the same, and a method for producing the same. Further, it is possible to provide a polyimide composition that improves alkali developability, particularly enables sodium carbonate alkali developability, and is suitable as a coverlay material for flexible wiring boards, a flexible wiring board using the same, and a method for producing the same. It is in. [Solution] In the present invention, a hydrolyzate produced by alkali development after exposure to alkali development can be fixed to polyimide by reacting with a crosslinking agent, and the white powder is exposed without acid washing after alkali development. Can be prevented. Furthermore, by selecting a specific material as a component constituting the polyimide compound, alkali solubility can be enhanced, and further, low elasticity and flame retardancy required as a coverlay material for a flexible wiring board can be obtained. [Selection] Figure 5 |