http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013182996-A

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filingDate 2012-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f8d0bf8fd842c6fee698a0c1ede3353
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publicationDate 2013-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2013182996-A
titleOfInvention Dry etching apparatus and dry etching method
abstract Provided is a dry etching apparatus capable of highly uniform etching even when a quartz shower plate is used in order to use a corrosive gas. In a dry etching apparatus including a stage on which a wafer is placed, an antenna electrode, a high frequency power source, a shower plate, and a high frequency bias power source, a high frequency bias is provided on the antenna electrode side. The counter resonance grounding means 104 is provided which is in series resonance with the electrostatic reactance formed by the shower plate 116 with respect to the frequency of the frequency and changes the impedance by the variable inductive reactance and grounds it. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019061848-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102484512-B1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9899424-B2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7115759-B2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002093784-A
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Total number of triples: 30.