http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013175933-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_76f595ac54dedcd4462857c633360f85 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-332 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-22 |
| filingDate | 2012-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c35b9cc94ad6e3008d84c8b47bc82fbe http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cb20c386bf64a4b2dac22a502641e111 |
| publicationDate | 2013-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2013175933-A |
| titleOfInvention | Method for manufacturing piezoelectric element |
| abstract | PROBLEM TO BE SOLVED: To simplify a process in a method for manufacturing a piezoelectric element using wet etching and dry etching. The manufacturing method of the present invention includes the following steps. A step of creating a wet mask for wet etching (S11). A step of creating a dry etching mask having resistance to wet etching on the wet mask (S12). A step of performing wet etching using a wet mask and a dry mask (S13). After wet etching, a dry etching process using a wet mask and a dry mask (S14). After the dry etching, a second wet etching process using the wet mask and the dry mask (S15). After the second wet etching, a step of removing the wet mask and the dry mask (S16). [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016178590-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10794274-B2 |
| priorityDate | 2012-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.