| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2dcebf5a7f7ddc3b081f70e8ce1c4097
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6b0da90b70dea5317b1d57d11692a527 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62 |
| filingDate |
2011-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1422042e28e7339aa99f2a7f128ed1d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_281925584092f66b9cdc597c59819ff6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb2a4190e5529d76fe04a7a29ab2a8b4 |
| publicationDate |
2013-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2013128076-A |
| titleOfInvention |
LED lead frame and manufacturing method thereof |
| abstract |
Provided is an LED lead frame that can be easily formed and includes a reflective film that can maintain a high reflectance for a long period of time without being discolored by a sulfur component, and that is suitable for mounting or soldering by wire bonding. . A lead frame (1) has a substrate (11) made of Cu or a Cu alloy and an Ag plating film (12) having a film thickness of 0.6 to 8 μm, a film having a thickness of 1 to 15 nm made of Ti, Zr or an alloy based thereon. A metal intermediate film 13 and a noble metal film 14 having a thickness of 2 to 50 nm made of Pd or Pt are stacked. By covering the Ag plating film 12 with the metal intermediate film 13, it is possible to prevent halogen ions and sulfur from coming into contact with the Ag plating film 12 from the outside, resulting in a reflective film having excellent durability, and the noble metal film 14 is formed on the outermost surface. By providing, wire bondability and solderability are imparted. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9865778-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102514757-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016143814-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016071456-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170120892-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015152652-A1 |
| priorityDate |
2011-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |