| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a665d61597c2731ab4130971ee397dc9 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23H5-08 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1454 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 |
| filingDate |
2011-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_548261b667c46c3d0d013a70c67a06a4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8731dc0af48e2813c8fd4221a896f00c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56671bd4995cd031f3314280c885e2d1 |
| publicationDate |
2013-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2013102051-A |
| titleOfInvention |
Polishing composition, polishing method using the same, and substrate manufacturing method |
| abstract |
Disclosed is a polishing composition suitable for polishing noble metals and use thereof. The present invention relates to a polishing composition for use in polishing a polishing object having a conductive layer and a conductive material layer in contact with the conductive layer, wherein the polishing composition is used in a polishing composition at room temperature. Under the condition that the positive electrode side of the meter is connected to the conductive material and the negative electrode side is connected to the conductor, the value of the current flowing from the positive electrode side to the negative electrode side when the conductive material and the conductor are polished is a positive value (zero) And a polishing composition characterized by the above. Furthermore, it is preferable that the polishing composition contains an additive that makes a value of current flowing between the conductor and the conductive material positive (including zero). [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015040979-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2015040979-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015195946-A1 |
| priorityDate |
2011-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |