http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013098483-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a07d0b3e3169dd026ecd9113fc9cc4ad |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 |
filingDate | 2011-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8ff4654d1762178d2dd17fb3e847e0c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9abb310aa31b9e49f75c1b32fc72a55 |
publicationDate | 2013-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2013098483-A |
titleOfInvention | Dry etching equipment |
abstract | Provided is a dry etching apparatus in which the etching amount is uniform and the temperature of a wafer during etching can be set to both normal temperature and low temperature. For room temperature etching, which is made of the same material as the wafer 6 to be etched, is provided so as to be detachable with respect to the clamp 7, is provided so as to surround the periphery of the wafer 6 in a top view, and is etched together with the wafer 6. The dummy wafer 10 and the wafer 6 to be etched are made of the same material, and are provided so as to be detachable with respect to the clamp 7, and are provided so as to surround the periphery of the wafer 6 in a top view, and are interposed between the clamp 7 and the wafer 6. The wafer 6 is fixed to the lower electrode 4, and a low temperature etching dummy wafer 11 is etched together with the wafer 6, and etching is performed using any one of the dummy wafers 10, 11. [Selection] Figure 1 |
priorityDate | 2011-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Predicate | Subject |
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isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24261 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457707758 |
Total number of triples: 13.