http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013098483-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a07d0b3e3169dd026ecd9113fc9cc4ad
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
filingDate 2011-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8ff4654d1762178d2dd17fb3e847e0c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9abb310aa31b9e49f75c1b32fc72a55
publicationDate 2013-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2013098483-A
titleOfInvention Dry etching equipment
abstract Provided is a dry etching apparatus in which the etching amount is uniform and the temperature of a wafer during etching can be set to both normal temperature and low temperature. For room temperature etching, which is made of the same material as the wafer 6 to be etched, is provided so as to be detachable with respect to the clamp 7, is provided so as to surround the periphery of the wafer 6 in a top view, and is etched together with the wafer 6. The dummy wafer 10 and the wafer 6 to be etched are made of the same material, and are provided so as to be detachable with respect to the clamp 7, and are provided so as to surround the periphery of the wafer 6 in a top view, and are interposed between the clamp 7 and the wafer 6. The wafer 6 is fixed to the lower electrode 4, and a low temperature etching dummy wafer 11 is etched together with the wafer 6, and etching is performed using any one of the dummy wafers 10, 11. [Selection] Figure 1
priorityDate 2011-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24261
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457707758

Total number of triples: 13.