http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013089670-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9d5fd78419494988d8a125d13bb1efdd |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48472 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36 |
| filingDate | 2011-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b1a51fcafee066f953cf625790165414 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50af69ccbf92c1ed5877cde76f8bc893 |
| publicationDate | 2013-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2013089670-A |
| titleOfInvention | Heat dissipation member and method for manufacturing semiconductor module |
| abstract | The present invention provides a heat radiating member having an insulating resin layer formed of a thermosetting adhesive having a relatively fast curing reaction rate and excellent long-term adhesion capability, and facilitates a semiconductor module with excellent heat dissipation. A method of manufacturing is provided. An insulating resin layer 10 made of a thermosetting adhesive containing boron nitride particles (A), an epoxy resin (B), and a phenol resin (C) is provided, and one surface side of the insulating resin layer 10 is covered. A heat-dissipating member 1 that adheres and cures to the adherend and dissipates the heat of the adherend through the insulating resin layer 10 and contains boron nitride particles in a proportion of 40% by volume to 65% by volume. Hydroxyphenylmethane type epoxy resin is contained, and the phenolic resin contains at least one of phenol novolac resin, phenol aralkyl resin, and trishydroxyphenylmethane type phenolic resin, and further contains tetraphenylphosphonium tetraphenylborate. It is characterized by. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200092932-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020174179-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019112048-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022210686-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021103783-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7240432-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020067364-A1 |
| priorityDate | 2011-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 100.