| abstract |
(57) [Problem] To provide an epoxy resin composition, a film-like adhesive, and a cured product which are useful for an insulating resin layer of a build-up multilayer printed wiring board, an adhesive for connecting a substrate of a semiconductor element, and the like. SOLUTION: (A) an epoxy resin, (B) a curing agent, In an epoxy resin composition containing (C) a phenoxy resin, (D) a rubber component and (E) a curing accelerator, (B) The component comprises a phenol biphenyl aralkyl type resin curing agent, and the component (C) comprises a bisphenol A type phenoxy resin or a bisphenol F type phenoxy resin, The component (D) has the following general formula (3), (4) or (5): Wherein the content of the phenoxy resin or the elastomer is 5 to 50 watts each. A composition that is at%. |