| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09854
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-2054
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-087 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-422 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 |
| filingDate |
2011-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ff2d03172769bd7bc81d5732425af99d |
| publicationDate |
2013-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2013048181-A |
| titleOfInvention |
Pattern forming apparatus, pattern forming method, and pattern forming substrate manufacturing method |
| abstract |
A conductor is formed in a hole by modifying only the inner surface of the hole, such as a via hole, a contact hole, or a through hole. A substrate is provided with a via hole having a diameter increasing from an opening on an upper surface to a opening on a lower surface. On the lower surface of the substrate 100, a light reflecting substrate 46 having a minute uneven shape formed on the surface is disposed. When the laser beam L is irradiated from the irradiation unit 40 to the via hole 110, the laser beam incident from the opening of the via hole 110 is scattered and reflected by the surface of the light reflecting substrate 46 disposed on the lower surface of the substrate 100. The reflected light of the laser beam L is applied to the inner surface 110a of the via hole 110, and the inner surface 110a is surface-modified. [Selection] Figure 4 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2017026127-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020053582-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017228669-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016065979-A |
| priorityDate |
2011-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |